JPH0635476Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0635476Y2 JPH0635476Y2 JP13866786U JP13866786U JPH0635476Y2 JP H0635476 Y2 JPH0635476 Y2 JP H0635476Y2 JP 13866786 U JP13866786 U JP 13866786U JP 13866786 U JP13866786 U JP 13866786U JP H0635476 Y2 JPH0635476 Y2 JP H0635476Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- frame
- external leads
- guide frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13866786U JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13866786U JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6344457U JPS6344457U (en]) | 1988-03-25 |
JPH0635476Y2 true JPH0635476Y2 (ja) | 1994-09-14 |
Family
ID=31043856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13866786U Expired - Lifetime JPH0635476Y2 (ja) | 1986-09-10 | 1986-09-10 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0635476Y2 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022185515A1 (ja) * | 2021-03-05 | 2022-09-09 | 三菱電機株式会社 | 半導体モジュール |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2722639B2 (ja) * | 1989-04-07 | 1998-03-04 | 日本電気株式会社 | 集積回路パッケージ |
JP5556316B2 (ja) * | 2010-04-02 | 2014-07-23 | 株式会社デンソー | 表面実装型電子部品及び表面実装型電子部品の実装構造 |
-
1986
- 1986-09-10 JP JP13866786U patent/JPH0635476Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022185515A1 (ja) * | 2021-03-05 | 2022-09-09 | 三菱電機株式会社 | 半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JPS6344457U (en]) | 1988-03-25 |
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